About the Journal

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Aims and scope

Light: Advanced Manufacturing LAM is a new, highly selective, open-access, and free of charge international sister journal of the Nature Journal Light: Science & Applications. The journal is aimed to publish innovative research in all modern areas of preferred light-based manufacturing, including fundamental and applied research as well as industrial innovations.

LAM is published by the Light Publishing Group and sponsored by the Ji hua Laboratory (Guangdong Province, Foshan City) in close cooperation with the CIOMP (Changchun, http://english.ciomp.cas.cn/).

Topics of interest include, but are not limited to, the following:

- Metrology and Standards

- Detection and Sensing

- Characterization and In-Situ Measurement

- Advanced Semiconductor Manufacturing 

- Extreme Manufacturing and Metrology

- Micro/Nano Manufacturing Technologies

- Laser Processing and Manufacturing

- Flexible Optoelectronics Technologies

- Photonic Integration Technologies

- AI-Assisted Photonics

- Terahertz and Infrared Technologies

- Space Optics Technologies

- Light Field Display and Manipulation Technologies

- Mesoscopic Imaging

- Atomic-Scale Manufacturing

Author benefits

- Rigorous and timely peer review process

- Professional copyediting and typesetting

- Diamond Open Access: free of charge publishing

- Wide exposure to a large global audience

- ScholarOne Manuscript tracking system

- Intended future referencing on the Web of Science platform (Clarivate Analytics)

- Online publication 2 weeks after acceptance

- Free inclusion of supplementary material (multimedia content)

- Awarding of the most influential papers at the Annual Light Conference

- Highlighting new business and supporting young entrepreneurs in dissemination of their products

In addition to the cutting-edge research, LAM offers a comprehensive view of the latest technological advances in light-based industries covering a wide range of design, fabrication, testing, and application of innovative products, intending to bridge the gaps that often exist in moving technologies to market.


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