Depth measurement and three-dimensional (3D) imaging under complex reflection and transmission conditions are challenging and even impossible for traditional structured light techniques, owing to the precondition of point-to-point triangulation. Despite recent progress in addressing this problem, there is still no efficient and general solution. Herein, a Fourier dual-slice projection with depth-constrained localization is presented to separate and utilize different illumination and reflection components efficiently, which can significantly decrease the number of projection patterns in each sequence from thousands to fifteen. Subsequently, multi-scale parallel single-pixel imaging (MS-PSI) is proposed based on the established and proven position-invariant theorem, which breaks the local regional assumption and enables dynamic 3D reconstruction. Our methodology successfully unveils unseen-before capabilities such as (1) accurate depth measurement under interreflection and subsurface scattering conditions, (2) dynamic measurement of the time-varying high-dynamic-range scene and through thin volumetric scattering media at a rate of 333 frames per second; (3) two-layer 3D imaging of the semitransparent surface and the object hidden behind it. The experimental results confirm that the proposed method paves the way for dynamic 3D reconstruction under complex optical field reflection and transmission conditions, benefiting imaging and sensing applications in advanced manufacturing, autonomous driving, and biomedical imaging.

Mode-division multiplexing technology has been proposed as a crucial technique for enhancing communication capacity and alleviating growing communication demands. Optical switching, which is an essential component of optical communication systems, enables information exchange between channels. However, existing optical switching solutions are inadequate for addressing flexible information exchange among the mode channels. In this study, we introduced a flexible mode switching system in a multimode fibre based on an optical neural network chip. This system utilised the flexibility of on-chip optical neural networks along with an all-fibre orbital angular momentum (OAM) mode multiplexer-demultiplexer to achieve mode switching among the three OAM modes within a multimode fibre. The system adopted an improved gradient descent algorithm to achieve training for arbitrary 3 × 3 exchange matrices and ensured maximum crosstalk of less than −18.7 dB, thus enabling arbitrary inter-mode channel information exchange. The proposed optical-neural-network-based mode-switching system was experimentally validated by successfully transmitting different modulation formats across various modes. This innovative solution holds promise for providing effective optical switching in practical multimode communication networks.

Organic proteins are attractive owing to their unique optical properties, remarkable mechanical characteristics, and biocompatibility. Manufacturing multifunctional structures on organic protein films is essential for practical applications; however, the controllable fabrication of specific structures remains challenging. Herein, we propose a strategy for creating specific structures on silk film surfaces by modulating the bulging and ablation of organic materials. Unique surface morphologies such as bulges and craters with continuously varying diameters were generated based on the controlled ultrafast laser-induced crystal-form transition and plasma ablation of the silk protein. Owing to the anisotropic optical properties of the bulge/crater structures with different periods, the fabricated organic films can be used for large-scale inkless color printing. By simultaneously engineering bulge/crater structures, we designed and demonstrated organic film-based optical functional devices that achieves holographic imaging and optical focusing. This study provides a promising strategy for the fabrication of multifunctional micro/nanostructures that can broaden the potential applications of organic materials.

We describe how a direct combination of an axicon and a lens can represent a simple and efficient beam-shaping solution for laser material processing applications. We produce high-angle pseudo-Bessel micro-beams at 1550 nm, which would be difficult to produce by other methods. Combined with appropriate stretching of femtosecond pulses, we access optimized conditions inside semiconductors allowing us to develop high-aspect-ratio refractive-index writing methods. Using ultrafast microscopy techniques, we characterize the delivered local intensities and the triggered ionization dynamics inside silicon with 200-fs and 50-ps pulses. While similar plasma densities are produced in both cases, we show that repeated picosecond irradiation induces permanent modifications spontaneously growing shot-after-shot in the direction of the laser beam from front-surface damage to the back side of irradiated silicon wafers. The conditions for direct microexplosion and microchannel drilling similar to those today demonstrated for dielectrics still remain inaccessible. Nonetheless, this work evidences higher energy densities than those previously achieved in semiconductors and a novel percussion writing modality to create structures in silicon with aspect ratios exceeding ~700 without any motion of the beam. The estimated transient change of conductivity and measured ionization fronts at near luminal speed along the observed microplasma channels support the vision of vertical electrical connections optically controllable at GHz repetition rates. The permanent silicon modifications obtained by percussion writing are light-guiding structures according to a measured positive refractive index change exceeding 10⁻². These findings open the door to unique monolithic solutions for electrical and optical through-silicon-vias which are key elements for vertical interconnections in 3D chip stacks.

Emission of THz radiation from air breakdown at focused ultra-short fs-laser pulses (800 nm/35 fs) was investigated for the 3D spatio-temporal control where two pre-pulses are used before the main-pulse. The laser pulse induced air breakdown forms a ~ 120 μm-long focal volume generate shockwaves which deliver a denser air into the focal region of the main pulse for enhanced generation of THz radiation at 0.1–2.5 THz spectral window. The intensity of pre- and main-pulses was at the tunnelling ionisation intensities (1–3) × 10¹⁶ W/cm² and corresponded to sub-critical (transparent) plasma formation in air. Polarisation analysis of THz radiation revealed that orientation of the air density gradients generated by pre-pulses and their time-position locations defined the ellipticity of the generated THz electrical field. The rotational component of electric current is the origin of THz radiation.

State-of-the-art commercially available 3D laser micro- and nanoprinters using polymeric photoresists based on two- or multi-photon absorption rely on high-power pico- or femtosecond lasers, leading to fairly large and expensive instruments. Lately, we have introduced photoresists based on two-step absorption instead of two-photon absorption, allowing for the use of small and inexpensive continuous-wave 405 nm wavelength GaN semiconductor laser diodes with light-output powers below 1 mW. Here, using the identical photoresist system and similar laser diodes, we report on the design, construction, and characterization of a 3D laser nanoprinter that fits into a shoe box. This shoe box contains all optical components, namely the mounted laser, the collimation- and beam-shaping optics, a miniature MEMS xy-scanner, a tube lens, the focusing microscope objective lens (NA=1.4, 100× magnification), a piezo slip-stick z-stage, the sample holder, a camera monitoring system, LED sample illumination, as well as the miniaturized control electronics employing a microcontroller. We present a gallery of example 3D structures printed with this instrument. We achieve about 100 nm lateral spatial resolution and focus scan speeds of about 1 mm/s. Potentially, our shoe-box-sized system can be made orders of magnitude less expensive than today’ s commercial systems.

Optical micro/nanofibers (MNFs) taper-drawn from silica fibers possess intriguing optical and mechanical properties. Recently, MNF array or MNFs with identical geometries have been attracting more and more attention, however, current fabrication technique can draw only one MNF at a time, with a low drawing speed (typically 0.1 mm/s) and a complicated process for high-precision control, making it inefficient in fabricating multiple MNFs. Here, we propose a parallel-fabrication approach to simultaneously drawing multiple (up to 20) MNFs with almost identical geometries. For fiber diameter larger than 500 nm, measured optical transmittances of all as-drawn MNFs exceed 96.7% at 1550-nm wavelength, with a diameter deviation within 5%. Our results pave a way towards high-yield fabrication of MNFs that may find applications from MNF-based optical sensors, optical manipulation to fiber-to-chip interconnection.

Microwave antennas are essential elements for various applications, such as telecommunication, radar, sensing, and wireless power transport. These antennas are conventionally manufactured on rigid substrates using opaque materials, such as metal strips, metallic tapes, or epoxy pastes; thus, prohibiting their use in flexible and wearable devices, and simultaneously limiting their integration into existing optoelectronic systems. Here, we demonstrate that mechanically flexible and optically transparent microwave antennas with high operational efficiencies can be readily fabricated using composite nanolayers deposited on common plastic substrates. The composite nanolayer structure consists of an ultra-thin copper-doped silver film sandwiched between two dielectric films of tantalum pentoxide and aluminum oxide. The material and thickness of each constituent layer are judiciously selected such that the whole structure exhibits an experimentally measured averaged visible transmittance as high as 98.94% compared to a bare plastic substrate, and simultaneously, a sheet resistance as low as 12.5 Ω/sq. Four representative types of microwave antennas are implemented: an omnidirectional dipole antenna, unidirectional Yagi-Uda antenna, low-profile patch antenna, and Fabry-Pérot cavity antenna. These devices exhibit great mechanical flexibility with bending angle over 70°, high gain of up to 13.6 dBi, and large radiation efficiency of up to 84.5%. The proposed nano-engineered composites can be easily prepared over large areas on various types of substrates and simultaneously overcome the limitations of poor mechanical flexibility, low electrical conductivity, and reduced optical transparency usually faced by other constituent materials for flexible transparent microwave antennas. The demonstrated flexible microwave antennas have various applications ranging from fifth-generation and vehicular communication systems to bio-signal monitors and wearable electronics.

The manipulation of micro/nanostructures to customise their inherent material characteristics has garnered considerable attention. In this study, we present the selective activation of gallium arsenide (GaAs) via ultrafast laser-induced decomposition, which correlates with the emergence of ripples on the surface. This instigated a pronounced enrichment in the arsenic (As) concentration around the surface while inducing a depletion of gallium (Ga) at the structural depth. Theoretical simulations based on first principles exhibited a robust inclination towards the phase separation of GaAs, with the gasification of As–As pairs proving more facile than that of Ga–Ga pairs, particularly above the melting point of GaAs. As an illustrative application, a metal-semiconductor hybrid surface was confirmed, showing surface chemical bonding and surface-enhanced Raman scattering (SERS) through the reduction of silver ions on the laser-activated pattern. This laser-induced selective activation holds promise for broader applications, including the controlled growth of Pd and the development of Au/Ag alloy-based platforms, and thereby opens innovative avenues for advancements in semiconductors, solar cell technologies, precision sensing, and detection methodologies.